摘要
论述了当前电子设计自动化 (electronicdesignautomatic ,EDA)设计中普遍存在的异地异构设计数据互不兼容而产生的一系列问题。在分析了市场需求的基础上 ,引出了EDA协同设计集成环境的概念 ,并以Cadence和Mentor的印刷电路板 (printedcircuitboard ,PCB)设计数据融合技术为例进行了详细阐述 ,为EDA工具在PCB级的集成提出了一条崭新的思路。
The problems such as heterogenous design data being not compatible in current electronic design automatic (EDA) design are discussed. On the basis of analysis of market demand, the concept of jointed EDA integration design circumstance is put forward. The data fusion technology of Cadence and Mentor in printed circuit board (PCB) layout is discussed as an example in detail, and this is a new way for EDA tools integration with PCB layout.
出处
《系统工程与电子技术》
EI
CSCD
北大核心
2003年第2期239-244,共6页
Systems Engineering and Electronics
基金
国家"86 3"高技术计划CIMS设计自动化项目资助课题 ( 86 3-5 11-70 7-0 0 7)
关键词
电子设计自动化
印刷电路板
异构
数据融合
Elcetronic design automatic
Printed circuit board
Heterogenous
Data fusion