摘要
文中主要论述了硬件在环混合仿真(Hardware-in-the-Loop)技术在中国汽车工业中的应用前景,着重讨论了再开发电子控制单元(ECU)方面的应用,并举例说明了HiL技术的具体应用。针对中国加入WTO后可能面对的一系列问题,尤其是国内汽车整车及零部件供应企业所面临的挑战,提出作者的一些看法和对策。
In this paper, the application of Hil technology in China automotive industry is discussed. It is focused on the development of ECU and gives out a practical example. For series problems facing China after its entry into WTO, especially the challenges faced by domestic automotive manufacturers and parts suppliers, some suggestions and policies are presented.
出处
《上海汽车》
2003年第1期28-30,共3页
Shanghai Auto