异种材料TLP扩散连接过程的非对称性

Dissymmetry of TLP diffusion bonding of dissimilar materials

通过对SiC颗粒增强Al基复合材料与Al合金的TLP扩散连接试验,对异种材料TLP扩散连接过程存在的非对称性进行了深入的研究,并对异种材料TLP扩散连接过程的等温凝固动力学进行了数学建模,且结合接头区域的成分分布进行了验证。研究表明:SiC颗粒增强铝基复合材料与铝合金连接接头区域连接界面向铝合金一侧偏移,接头区域溶质原子成分分布非常不均匀;由于溶质原子扩散速度以及中间层和母材冶金反应的不同,导致异种材料TLP扩散连接过程存在明显的非对称性。所建的等温凝固动力学模型能够用来解释异种材料TLP扩散连接过程,对于异种材料连接具有重要的理论意义。

Based on the experimental study on TLP diffusion bonding of SiC particle reinforced Albased composite and aluminium alloy, the extensive study on the dissymmetry of dissimilar materials TLP diffusion bonding process was conducted, and the isothermal solidification kinetics of TLP diffusion bonding process of dissimilar materials was mathematical modeled. The numerical results were compared with the content profiles of each element in the joint area. The research indicates that the bonding interface departures to aluminium alloy from the original central line in the joint area of SiC particle reinforced Albased composite and aluminium alloy, and the content profile of solute atoms distributes fairly asymmetrically. Because of difference of the solute atoms diffusion speeds and the metallurgical reaction between interlayer and base metal, the dissymmetry exists obviously in dissimilar materials TLP diffusion bonding process. And the isothermal solidification kinetics model can be used for illustrating TLP diffusion bonding process of dissimilar materials.