国内外钨铜复合材料的研究现状

CURRENT STATUS OF R&D OF W-Cu COMPOSITE MATERIALS IN CHINA AND ABROAD

W Cu具有好的导电导热性,低的热膨胀系数而被广泛地用作电接触材料、电子封装和热沉材料。纳米材料的研究发展将会大幅度拓展该材料在现代微电子信息技术的应用。本文从常规制备技术和纳米W Cu复合材料研究两方面综述了国内外对W Cu复合材料的研究发展状况,着重阐述了纳米W Cu复合材料的研究与优势,指出了今后的应用发展前景。

WCu is used widely as a contact material,electronic sealing and hot depositing material due to excellent electric conductivity,low thermal expansion.The R&D of nanometer WCu will expand it's application in the field of microelectronic IT very much.The traditional manufacturing technique and R&D of WCu composite material in China and abroad are described with a strese on advantages and prospect of nanometer WCu composite material.