TiB_2金属陶瓷与TiAl金属间化合物的扩散连接

Diffusion bonding of TiB_2 cermet to TiAl intermetallic

对TiB2 金属陶瓷与TiAl金属间化合物进行了扩散连接试验 ,研究了直接扩散连接和采用Ni为中间层进行扩散连接的接头界面结构及工艺参数对界面结构和连接性能的影响。直接扩散连接时 ,连接界面处生成了Ti(Cu ,Al) 2 金属间化合物 ,采用Ni为中间层进行扩散连接时 ,界面处生成了单层TiAlNi2 金属间化合物层和两层Ti,Al,Ni扩散层共三层结构。直接扩散连接时 ,连接温度T =12 2 3K ,时间t=1.8ks,压力p =80MPa时接头强度为 10 3MPa ;采用Ni为中间层时 ,连接温度T =12 73K ,时间t=1.8ks,压力p =80MPa时接头强度为 110MPa。

The diffusion bonding of TiB 2 cermet to TiAl intermetallic was studied in this paper.The effects of bonding parameters on the microstructure of the joints and mechanical properties was investigated.The results showed that a Ti(Cu,Al) 2 intermetallic layer was formed at the interface between TiB 2 cermet and TiAl intermetallic when directly diffusion bonding.A TiAlNi 2 intermetallic layer and two Ti,Al,Ni solid solution layers were formed at the interface by using Ni interlayer.The shear strength was 103 MPa when directly diffusion bonding with bonding temperature T =1 223 K,bonding time t =1.8 ks and bonding pressure p =80 MPa,and the shear strength was 110 MPa by using Ni layer with T = 1 223 K, t =1.8 ks and p =80 MPa.