摘要
压锭烧结NTC材料的电阻率沿径向分布,中心的电阻率明显高于表层的电阻率。电阻率的这种分布是由于在样品烧结过程中,中心部位缺氧,表层富氧;冷却时杂质向表层迁移,缺陷移动所致。笔者将讨论影响电阻率分布的原因及其规律。
Along the radius of the sintered NTC ingot, its resistivity is obviously higher in central segment than in the edge. Such resistivity is caused by the lack of oxygen in the central segment, impurity migration, and defect movement in the course of sintering and cooling. The factors that influence resistivity distribution and its distribution law are discussed.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第5期14-16,20,共4页
Electronic Components And Materials
