导电胶的可靠性与胶层内应力研究

On Reliability of Electrically Conductive Adhesives and Inner Stress in Adhesive Layer

讨论了影响导电胶可靠性的主要因素,认为胶层在固化完成进入正常使用阶段后所经历的环境温度变化可能是导致其老化现象产生的重要原因之一,今后的主要研究任务是开发能在常温下高效固化的新型导电胶。将电阻应变片直接设置于环氧胶层中,研究了在紫铜片基体上环氧树脂胶层经历了室温下的固化之后,在一定的环境温差作用下内应力随时间的变化情况,结果表明当环境温度变化时,胶层内应力为呈交替变化的拉伸应力。

The main factors influencing the reliability of electrically conductive adhesives are studied. It is believed that the stress variation in adhesive layer induced by the change of environmental temperature after curing procedure is a main cause of aging of electrically conductive adhesives. It is an important task to develop new kind of electrically conductive adhesives that could be cured fast under normal temperature. Embedded the strain gauges in the adhesive layer on the pure copper substrate, the strain changes in the adhesive layer induced by the curing procedure and the changes of environmental temperature were measured with strain gauges. The results obtained show that the inner stress varied greatly when temperature shifted and almost kept tensile state.