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基于SiGe BiCMOS工艺的90~100 GHz单刀双掷开关

A 90~100 GHz SPDT Switch Based on SiGe BiCMOS Process
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摘要 采用0.13μm SiGe BiCMOS工艺,设计了一种频带为90~100GHz的差分单刀双掷开关。首先对比分析了并联MOS管与串联MOS管,根据隔离度与损耗性能选择了并联结构。其次采用差分螺旋电感进行匹配,将双端口电感网络等效为变压器模型,显著抑制了共模信号。采用平面三维电磁仿真软件进行联合仿真。结果表明,在中心频点处,差模插入损耗为-4.1dB,共模插入损耗为-7.4dB,隔离度大于-22dB,输入反射系数S_(11)<-12dB,输出反射系数S_(22)<-10dB。芯片尺寸为570μm×140μm。 A differential single pole double throw(SPDT)switch with a band of 90 GHz to 100 GHz was designed in a 0.13μm SiGe BiCMOS process.Firstly,by comparing the insertion loss and isolation of the shunt and series switch,the shunt structure of the MOSFET was chosen.Secondly,the differential spiral inductor was used in the match network.The two-port inductance network could be equal to the model of transformer,and the common mode signal could be significantly suppressed by the analysis of simulation.Through simulating with the planar 3-D electromagnetic simulation software,the final results showed that,at the central frequency,the insertion loss of the differential-mode signal was-4.1 dB,the insertion loss of the common-mode signal was-7.4 dB,the isolation was greater than-22 dB,the input reflection coefficient S11 <-12 dB,and the output reflection coefficient S22<-10 dB.The chip area was 570μm×140μm.
作者 施雨 徐余龙 庞东伟 陈涛 桑磊 李庄 曹锐 SHI Yu;XU Yulong;PANG Dongwei;CHEN Tao;SANG Lei;LI Zhuang;CAO Rui(Institute of Opto-Electronic Technology,Hefei University of Technology,Hefei 230009,P.R.China;38th Research Institute,China Electronics Technology Group Corp.,Hefei 230009,P.R.China)
出处 《微电子学》 CAS 北大核心 2019年第1期88-92,共5页 Microelectronics
基金 国家重点研发计划政府间国际科技创新合作重点专项资助项目(2016YFE0100500)
关键词 SIGE BICMOS 共模抑制 单刀双掷开关 SiGe BiCMOS common mode rejection SPDT switch
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  • 1MIZUTANI H,IWATA N,TAKAYAMA Y,et al.Design considerations for traveling-wave single-pole multi-throw MMIC switch using fully distributed FET[J].IEEE Transactions on Microwave and Theory Techniques,2007,55(4):664-671.
  • 2MIN B W,CHANG M,REBEIZ G M.Si Ge T/R modules for Ka-Band phased arrays[C].IEEE Compound Semiconductor Integrated Circuit Symposium,Portland:IEEE,2007:1-4.
  • 3POH C H J,SCHMID R L,CRESSLER J D,et al.An X-Band to Ka-Band SPDT switch using 200 nm Si Ge HBTs[C].IEEE Silicon Monolithic Integrated Circuits in RF Systems,Santa Clara:IEEE,2012:183-186.
  • 4MIN B W,REBEIZ G M.Ka-band low-loss and highisolation switch design in 0.13μm CMOS[J].IEEE Transactions on Microwave and Theory Techniques,2008,56(6):1364-1371.
  • 5HETTAK K,ROSS T,WIGHT J,et al.DC to 70 GHz 90 nm3D CMOS SPDT using elevated CPW and CPS series stubs[C].IEEE International Microwave Symposium,Baltimore:IEEE,2011:1-4.
  • 6CHAO S F,KUO C C,TSAI Z M,et al.40 GHz MMIC SPDT and multiple-port bandpass filter-integrated switches[J].IEEE Transactions on Microwave and Theory Techniques,2007,55(12):2691-2699.
  • 7ZHENG X,TREMBLAY J C,HUETTNER S E,et al.Kaband high power Ga N SPDT switch MMIC[C].IEEE Compound Semiconductor Integrated Circuit Symposium,Monterey:IEEE,2013:1-5.
  • 8ENZ C.An MOS transistor model for RFIC design valid in all regions of operation[J].IEEE Transactions on Microwave and Theory Techniques,2002,50(1):342-359.
  • 9HAN J,SHIN H.A scalable model for the substrate resistance in multi-finger RF MOSFETs[C].IEEE MTT-S International Microwave Symposium Digest Philadelphia:IEEE,2003:2105-2108.

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