一种新型IGBT结温计算模型

A Novel IGBT Junction Temperature Calculation Model

为进一步研究IGBT电热参数与结温的关系,提出了一种用于计算IGBT结温的改进电热耦合模型。通过温度循环加速老化试验模拟IGBT的老化过程,记录不同老化程度下IGBT的电热参数,直到IGBT失效。根据电模型和热模型建立电热耦合模型,将不同老化程度下的电热参数及模型相结合,得到改进的电热耦合模型。采用单一参数法,研究了不同老化程度下电热参数对结温的影响。利用IGBT的稳态结温数据,得到电热参数对结温的影响度。

In order to further study the relationship between IGBT electro-thermal parameters and junction temperatures,an improved electro-thermal coupling model for calculating IGBT junction temperature was proposed.The aging process of the IGBT was simulated by the temperature cycling accelerated aging test,and the electro-thermal parameters of the IGBT under different aging conditions were recorded until the IGBT failed.An electro-thermal coupling model was established based on the electrical model and the thermal model.The electro-thermal parameters under different aging conditions and the electro-thermal coupling model were combined to obtain an improved electro-thermal coupling model.The influence of electro-thermal parameters on junction temperature under different aging conditions was studied by a single parameter method.Using the steady-state junction temperature data of the IGBT,the influence of the electro-thermal parameters on the junction temperature was obtained.