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硅各向异性腐蚀模型及其模拟进展 被引量:1

Progress on the Modelling and Simulation of Silicon Anisotropic Etching
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摘要 分析了硅各向异性腐蚀模型及其模拟的研究现状。介绍了两类主要的腐蚀模型—几何模型和原子模型各自的特点、利弊及发展变化的趋势 ,最后又列举了几种成熟的、应用不同模型的模拟软件。 In this article, the progress on the modelling and simulation of silicon anisotropic etching is presented. For two main etching models, i.e., geometrical model and atomic model, their characters including their advantages, shortcomings and the developing tendencies are all discussed seperately. Finally, some simulation softwares using above models are briefly introduced.
出处 《仪器仪表学报》 EI CAS CSCD 北大核心 2003年第1期81-85,共5页 Chinese Journal of Scientific Instrument
基金 教育部科学与技术研究重点项目资助课题 (0 0 0 65)
关键词 模拟 各向异性腐蚀 模型 微机械加工 MEMS CAD Anisotropic etching Model Silicon Micromachining
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参考文献1

  • 1黄庆安.硅微机械加工技术[M].北京:科学出版社,1995.51-119.

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  • 1CHAD O' NEAL B, AJAY MAISHE P, SUSHILA SINGH B, et al. Challenges in the Packaging of MEMS [C] //1999 International Symposium on Advanced Packaging Materials,1999: 41-47.
  • 2LIWEI LIN. MEMS Post-Packaging by Localized Heating and Bonding [J] . IEEE Trans. on Advanced Packaging,2000, 23 (4): 608-616.
  • 3DANELLE TANNER M, NORMAN SMITH F, LLOYD IRWIN W. MEMS Reliability: Infrastructure, Test Structures Modes Experiments, and Failure Modes [R] . America: Sandia Report, 2000.
  • 4World Leader in High Performance Signal Processing Solutionh [EB/OL] . (2005-12-01) [2006-01-04]. http: //www.analog.com/.
  • 5REZA GHAFFARIAN, DAVID Sutton G, PAUL CHAF-FEE, et al. Reliability of Cots MEMS Accelerometer under Shock and Thermomechanical Cycling [C] //Surface Mount Technology Association, 2001.
  • 6石云波,刘俊,张文栋.MEMS中的封装技术研究[J].微纳电子技术,2003,40(7):235-237. 被引量:6

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