摘要
介绍了近年来金属化学 机械抛光 (CMP)技术的一些研究进展。内容包括CMP技术的实验方法进展与抛光效果的表征 ,CMP设备与消耗品的发展。分析了目前CMP技术存在的问题 ,提出了可能解决问题的一些建议。认为定量CMP速率方程的建立是解决好终点在线检测的关键之一。
Recent researches on chemical mechanical polishing(CMP) technology are reviewed, which include the advancements of CMP experimental methods, the characterization of the polishing effectiveness, the developments of CMP equipments and expendables. The troubles occurred in CMP technology are analyzed and some suggestions are proposed. It is concluded that establishment of a quantitative CMP rate equation is one of the key points in carring out the in situ terminal checkout.
出处
《应用化学》
CAS
CSCD
北大核心
2003年第5期415-419,共5页
Chinese Journal of Applied Chemistry
基金
国家杰出青年科学基金资助 ( 5 992 5 412 )
关键词
金属
化学机械抛光
综述
metal,chemical mechanical polishing,review
