SiCp/Al复合材料在电子封装应用中的基础研究

Fundamental Study of SiCp/Al Composites in Electronic Packaging Applications

采用挤压铸造方法，制备了高体积分数的SiC增强铝基复合材料。经扫描电镜分析，复合材料颗粒分布均匀，材料组织致密。通过改变铝合金成分与SiC含量，SiCp／Al复合材料材料热膨胀系数介于(6．9—9．7)×10^-6℃^-1之间可调，热导率大于120W／(m·℃)，材料的比强度、比模量高。对材料表面涂覆性能进行了可行性研究，得到了实用的Ni和Cu镀层。

Aluminum matrix composites have found an application in electronic package and thermal management because of their light-weight, high thermal conductivity, compatible coefficient of thermal expansion (CTE) with chips or substrates, and enhanced specific modulus. In this study, aluminum matrix composites reinforced with large content of SiC particles were fabricated by squeeze-casting technology. The results show that the composites are dense and SiC particles distributed uniformly. The linear CTE of SiCp/Al composites lies between (6.9 ~ 9.7)10-6℃1, the thermal conductivity is larger than 120 W/(m℃), and the composites exhibits a high specific strength and specific modulus. The plating characteristics are investigated to understand its feasibility in electronic packaging, and practical nickel or copper layer is established successfully on the composite.