片式元件三层端电极技术

Tri-layer Terminal Electrode Technology for Chip Components

研制出了ZF410低应力镀镍、ZF305中性纯锡电镀液和添加剂,并在片式元件三层端电极上获得成功应用。介绍了该工艺的主要性能及具体工艺配方。该工艺解决了片式元件基材腐蚀问题,所镀产品质量稳定可靠,各项指标均符合IEC—384—10标准;实现了片式元件无损电镀工艺的国产化,降低了生产成本。

ZF410 plating solution plus additives for low inner stress nickel electroplating process and ZF305 plating solution plus additives for neutral pure tin electroplating process were developed, and successfully used in the tri-layer terminal electrode technology for chip components. The features and formulation are presented. With the processes, corrosion is eliminated. Of the product, the quality is stabile and reliable; the specifications meet IEC-384-10. The Chinese loss-free electroplating processes make it possible to reduce the plating cost.