摘要
根据薄膜附着机理,综述了影响金属薄膜附着性的因素。通过引入中间过渡层,减少应力来提高薄膜与衬底之间的结合强度,改善金属薄膜的性能。适当的热处理不仅能消除内应力,增强界面反应,而且对薄膜的性能有一定的影响。
Based on the mechanism of film adhesion, the factors influencing the adhesion between films and substrates are briefly reviewed. The binding strength of the films can be improved by decreasing the stress between the film and the substrate with an interlayer inserted in between. The performance of the metallic film can also be improved in this way. By proper heat treatment, inner stress can be eliminated, interface reaction can be enhanced and the metallic film performances can be influenced.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第6期41-44,共4页
Electronic Components And Materials
基金
军事电子预研基金资助项目(AW030412)
