摘要
重点介绍了国内外半导体器件制造工艺与器件可靠性的相关性报道:工艺缺陷、微缺陷、关键工艺对器件质量和可靠性的影响及其控制方法;还介绍了关键工艺控制点的确定及其参数控制范围以及生产高质量、高可靠性器件的工艺环境的控制要求。
The process defect, minor defect and key precess, their impact on quality and reliability, and the control method are introduced. The key control points, the parameter control scope and the requirement of process environment for high quality and reliability device are discussed.
出处
《电子产品可靠性与环境试验》
2003年第2期29-35,共7页
Electronic Product Reliability and Environmental Testing
