摘要
为满足电子系统的表面贴装技术、微组装技术发展的需要,对器件片式化、小型化、微型化的要求越来越高。而电感作为电路的三大基础性元件之一,其片式化、薄膜化势在必行。本文就近几年国内外片式薄膜电感的发展研究状况做一综述。
To satisfy the requirement of the growing surface mount technology (SMT) and microelectronic packaging technology (MPT), film chip and miniature components are in great demand, such as inductor one of the three basic electronic components. This paper summarizes the research and development of thin-film inductor in recent years.
出处
《磁性材料及器件》
CAS
CSCD
2003年第2期37-38,共2页
Journal of Magnetic Materials and Devices
关键词
薄膜电感
结构
工艺
thin-film inductor
structure
technology
