摘要
介绍印制板插头镀金工艺及原理、镀金液消耗过快的原因分析及插头镀金的工艺改进。
Technique and principium of contact gilding for printed board is introduced,and reasons of no-plated,plating solution rapid-consumed in contact gilding are analyzed.
出处
《电子元器件应用》
2003年第4期62-63,共2页
Electronic Component & Device Applications
