新型酚醛树脂固化过程的表征研究

STUDY ON THE CHARACTERIZATION ON THE CURING PROCESS OF THE NEW PHENOLIC RESIN

主要利用DSC、TC及IR技术研究了新型S157酚醛树脂体系的固化反应及其动力学、树脂体系中改性剂含量对固化反应的影响及固化过程中树脂体系结构变化规律,为确定新型S157酚醛树脂体系的固化工艺提供依据。新型S157酚醛树脂体系的固化反应表观活化能约为82kJ/mol,固化反应级数为0.91;有机硅改性剂的加入及其含量对树脂基体固化反应表观活化能、固化反应级数和热分解温度基本无影响,但失重率有所降低;在树脂基体等温固化过程中,活性羟甲基指数逐渐降低,树脂在高温固化过程中由于受到氧化而产生羰基吸收。

The curing reaction and curing kinetics, the effect of modifying agent content on the curing reaction and the struc- ture changes in the curing process of S157 phenolic resin system are studied by using differential scanning calorimetry(DSC) , thermo-gravimetry (TG) and infrared spectroscopy (IR). The curing process parameters of S157 phenolic resin system are obtained. The apparent activation energy of the curing reaction of the resin system is about 82 kJ/mol, the level of the curing reaction is about 0. 91. There is little effect of modifying agent content on the apparent activation energy, the level of curing reaction and the decomposing temperature of the resin system. The ratio of weight loss is slightly decreased with the increasing of modifying agent content. During the curing process at 160℃, the hydroxymethyl index is gradually reduced, the carbonyl index is increased with the curing time due to oxidation.