BGA/CSP封装技术的研究

BGA/CSP Packaging Techniques

从IC封装技术发展趋势的角度介绍了BGA/CSP封装理论和技术优势 .阐述了植球机的基本构成和工作原理 .植球机由印刷、搭载和检查工程 3个工程组成 .介绍了BGA/CSP封装型芯片的制造流程 .指出 :IC的BGA/CSP封装技术在高端IC封装领域占主导地位 ,是未来发展的方向 ;致力于成为IC制造大国的中国 。

BGA/CSP packaging theory and its advantages in IC packaging field are discussed from the viewpoint of IC developing trend together with construction & principle of ball mounters. The ball mounting system proposed consists of three engineering processes Printing, Mounting & Inspection. It is pointed out that BGA/CSP packaging takes the leading position in the high-end IC packaging fields, and represents the future development trend of IC packaging. As a nation who makes every effort to be a large IC maker, China must study further its theory and development.