微电子封装的发展及封装标准

Development of Semiconductor Devices Package and the Package Standards

分析了当前微电子封装的发展趋势,简要介绍了2002年国际电工委员会年会(北京)47D分组会上讨论和通过的半导体器件封装标准的情况。

This paper introduces thedevelopment tendency of today'ssemiconductor devices package andintroduces the situation about packagestandards concerned, which had beendiscussed and passed on 2002IEC(Beijing) 47D subcommittee.Keyword: semiconductor devices;package; standard