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TiO_2含量对倒装LED白光封装的发光性能的影响 被引量:3

Effects of TiO_2 concentrations on the luminous properties of flip-chip white LED package
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摘要 平面封装工艺正在应用于LED闪光灯等产品的制造。针对白光LED高光效、高散热、色温一致性的要求,利用新型的倒装LED芯片,并采用荧光粉和亚微米级TiO2颗粒分离的平面封装工艺制备白光LED,研究了不同TiO2掺杂硅胶的浓度对白光LED光通量、色温、显色指数等发光性能的影响。实验结果表明,0.4wt%的TiO2掺杂浓度比无TiO2掺杂的白光LED的光通量增长约6%,随着TiO2掺杂的质量百分比的继续增加,光通量逐渐减小。当TiO2的掺杂浓度到达5wt%时,光通量比无TiO2掺杂的白光LED的光通量减小了25%。在硅胶中掺杂TiO2能有效改善白光LED侧面漏蓝光的现象。 The planar packaging technology has been widely used in the fabrication of flash LEDs.In order to meet the requirements of high efficiency,high thermal conductivity and color temperature consistency,the flip-chip LEDs were packaged in white LED with phosphors and micron TiO2 powder in silicone.The influence of concentration on TiO2 dopant on luminous flux,correlated color temperature and color rendering index were investigated in this study.The experimental results showed that the luminous flux of white LED with 0.4wt% TiO2-doped silicone was 6% higher than of the white LED without TiO2 dopant.The luminous flux of the white LED went down while the doping concentration of TiO2 in silicone increased.When the concentration of TiO2 dopant was 5wt%,the luminous flux of the white LED was 25% lower than that of the TiO2-undoped white LED.The TiO2-doped silicone could improve the blue light leakage of white LED.
出处 《南昌大学学报(理科版)》 CAS 北大核心 2015年第1期56-59,共4页 Journal of Nanchang University(Natural Science)
基金 江西省科技厅对外合作项目(S00789)
关键词 倒装LED芯片 亚微米级TiO2掺杂硅胶 白光LED 光通量 色温 flip-chip LED submicron TiO2-doped silicone white LED luminous flux correlated color temperature
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  • 1Hsin-Chu Chen,Kuo-Ju Chen,Chien-Chung Lin,Chao-Hsun Wang,Hau-Vei Han,Hsin-Han Tsai,Hsuan-Ting Kuo,Shih-Hsuan Chien,Min-Hsiung Shih,Hao-Chung Kuo.Improvement in uniformity of emission by ZrO<SUB>2</SUB> nano-particles for white LEDs[J]. Nanotechnology . 2012 (26)
  • 2Yum, Jun-ho,Seo, Soo-Yeon,Lee, Seonghoon,Sung, Yung-Eun.Y 3 Al 5 O 12 :Ce 0.05 phosphor coatings on gallium nitride for white light emitting diodes. Journal of the Electrochemical Society . 2003
  • 3Mont, Frank W.,Kim, Jong Kyu,Schubert, Martin F.,Schubert, E. Fred,Siegel, Richard W.High-refractive-index TiO2-nanoparticle-loaded encapsulants for light-emitting diodes. Journal of Applied Physics . 2008
  • 4Burgess,Daniel S.LED update: Alternate packaging improves white LEDs. Photonics Spectra . 2005

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