优化层分配的无网格详细布线算法

A Gridless Detail Routing Algorithm Based On Optimization Layer Assignment

H-V布线模式下产生通孔的根本原因是由于不同线网间存在几何重叠或交叉;标准单元内布线主要应用多晶硅层与单金属层的布线层资源,考虑到不同层间相异的导电特性,文章提出了一种算法,基于网段拓扑交叉分析实现最大化金属层及最小化多晶层分配,优化线网通道分配与线长,同时满足通孔最小化。

ZAbstract:Under the H-V routing pattern,the radical causation why there exists via is because of geometric overlap and crossing between wirings.The resource always exists in poly layer and single metal layer in the cell routing.Refer to the different conduct electricity capability,an algorithm is presented which maximize the metal layer and minimize the poly layer assignment based on topological crossing analysis in the paper.Then it uses some planar routing technology for optimizing channel assignment and wiring length.At the same time ,it comforts the via minimization goal.