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化学复合镀PANI/Cu导电聚合物复合材料 被引量：3

PANI/Cu conductive polymer composites prepared by electroless deposition
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摘要 　采用化学复合镀技术在尼龙塑料PA66表面沉积PANI/Cu复合镀层。研究了复合镀层与基体的结合力和导电性,采用SEM观察镀层微观结构和表面形貌,并与纯铜、PANI镀层进行了比较;讨论了镀液pH值和温度等施镀工艺条件对镀层导电性能的影响。结果表明,PANI/Cu复合镀层具有良好的导电率且与基体结合紧密;增大镀液pH值和提高施镀温度,则其导电率增大。 PANI/Cu conductive polymer composite on PA66 plastic was obtained by electroless deposition. Adhension and conductivity of the composite layer were studied. Microstructure and morphology of the composite were investigated by scanning electron microscope. Effects of pH value and tmperature on conductivity of the composite layer were also discussed. Results showed that both conductivity and adhension of the composite layer were good, and conductivity of the composite layer increased with the increase of pH value and temperature.
作者 贺英 王均安 陈敏华
机构地区 上海大学材料科学与工程学院
出处 《电镀与涂饰》 CAS CSCD 2003年第3期14-17,共4页 Electroplating & Finishing
关键词 PANI/Cu 复合镀层 化学镀 导电聚合物 导电率 PANI/Cu composite layer electroless plating conductive polymer conductivity
分类号 TQ153.14 [化学工程—电化学工业] TQ153.3 [化学工程—电化学工业]
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参考文献8

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共引文献4

同被引文献29

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电镀与涂饰
2003年 第3期

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