摘要
介绍了高效率、高韧性、全有机氰化物光亮镀铜工艺。其BC系列、碱铜系列光亮剂能够大幅度提高铜镀层的沉积速度,光亮电流密度范围为0.15～5.0A/dm2,以2A/dm2的电流密度电镀时电流效率达到85%以上,沉积速度每分钟达到0.85μm以上。碱铜99A型光亮剂能够镀出镜面镀层。特别适用于锌基合金、铝合金电镀。
Copper plating process with high current yield and flexibility was developed in which organic cyanide was only used as brightener. The process was particularly suitable for electroplating of zinc alloy and aluminum alloy. Commercial brighteners in BC series and alkaline copper series could greatly improve the deposition rate of copper, and bright current density range is from 0.15 to 5.0 A/dm2. The process has current yield of above 85% at current density of 2 A/dm2, and deposition rate of over 0.85 μm/min. Mirror bright deposit could be obtained with the addition of alkaline copper 99A commercial brightener.
出处
《电镀与涂饰》
CAS
CSCD
2003年第3期35-38,共4页
Electroplating & Finishing
关键词
氰化物
镀铜
光亮剂
cyanide
copper plating
brightener
