SMT激光软钎焊质量监测方法研究

Investagation of SMT laser soldering quality monitoring method

本文作者研究了一种激光软钎焊接合部质量的实时监测方法,这一方法利用加热过程中接合材料之间的热电势与接合界面温度之间的对应关系,并根据有效加热热量(在阈值以上界面温度对加热时间的积分)与接合面积之间的规律,实时监测接合质量。实验结果表明,在软钎焊温度范围内,接合材料间热电势与界面温度之间具有良好的线性关系;实测有效加热热量充分地表现了接合部被加热及钎料的熔化情况,可以作为监测或控制激光软钎焊接合质量的参数。

In this paper, a method, which has been used in real-time monitoring of laser soldering quality, based on the relation between the thermoelectrical potential and temperature of joint face of the jointed materials and the relation between the efficient heating volume (the integral of the part of the interface temperature above the temperature threshold) and the joint area, is presented. The experimental results show that the relation of the thermoelectrical potential of the jointed materials and interface temperature is well linear, the measured efficient heating volume fully shows the condition of the heating and melting of the interface and solder and can be used in monitoring and controlling laser soldering system.