摘要
为了更深入的探讨多层板的制作,本文就多层板的结构、设计、叠合及压合操作条件等做一概略的介绍。
In order to go further into the manufacture methods of multilayer printed board,This article introduces the structure, design, layup and lamination operation condition etc.about multilayer printed board briefly.
出处
《印制电路信息》
2003年第4期32-35,共4页
Printed Circuit Information
关键词
多层板
压合制程
粘接片
叠合
制作工艺
冷却
multilayer printed board process design layup lamination operation
