PCB的化学镀锡应用技术

Application Technique of Electroless Tin in PCB

本文阐述PCB的绿色表面涂覆的化学镀锡工艺的有关理论和技术,化学镀锡应用是实现取代热风整平表面涂覆绿色化的最重要的手段之一,化学镀锡应用也是实现取代内层板棕化和黑化表面涂覆的产品换代升级已成必然之势。

The thesis describe theories and technology process of Electroless Tin for environmental equipment on surfaces coating in PCB,it is important means that Application technique of electroless Tin is going to replace Hot Air Solder levelling for environmental equipment on surfaces coating,it has becomed Inevitable trend which change the on behalf on product grade the ueep that Application technique of Electroless Tin is going to replace Brown Oxide&Black Oxiode of inner layer for environmental equipment on surfaces coating.