摘要
探讨了加热温度和钎料加入状态对真空钎焊CVD金刚石厚膜与硬质合金接头性能的影响,并对金刚石厚膜与Ag-Cu-Ti钎料的微观连接机理进行分析.结果表明:在940℃用90(Ag72-Cu)-10Ti钎料箔得到的接头强度较高,钎料中Ti与金刚石生成TiC是实现冶金连接的主要因素.
In this paper,the influence of heating temperature and filled material state on the properties of CVD diamond thick film by the vacuum brazing was discussed.The microstructure of CVD diamond thick film and AgCuTi filled material was analyzed. The results show that the joint strength with 90(Ag72Cu)10Ti filled material foil in 940℃ is high, and TiC produced by Ti and diamond in the filled material is the main factor in performing metallurgical bonding.
出处
《应用科技》
CAS
2003年第6期9-10,13,共3页
Applied Science and Technology
基金
黑龙江省自然科学基金资助项目(E01 21)
