氧化铝电子陶瓷封接件生产中流蜡、排蜡困难现象研究

Study on Phenomenon of Flowing-Wax and Wax Choked in the Production of Electronic Ceramics Sealing Parts of Alumina

陶瓷排蜡过程中出现的流蜡、排蜡困难问题成为影响我国电子陶瓷封接件质量和成品率的重要原因之一。本文研究了电子陶瓷封接件的表面质量以及经球磨和振动磨加工后的氧化铝粉材颗粒的形貌和粒度分布 ,探讨了氧化铝粉材的排蜡现象 ,分析了排蜡过程中产生流蜡、排蜡困难问题的原因 ,认为出现的问题与氧化铝粉材颗粒的粒度分布和形貌有着密切的关系。

The problems of flowing wax and wax choked in sintering process is one of the important factors that restrict quality and yield of electronic ceramics sealing parts in our country. In this paper,the surface quality of electronic ceramics sealing parts of alumina,the morphology and particle-size distribution of alumina particles processed by ball mill and vibration mill have been studied.The sintering process of alumina particles and the causes of flowing-wax and wax choked occurring in this process are also analyzed.It is believed that flowing wax and wax choked in sintering process have a close relationship with morphology and particle-size distribution of alumina particles.