摘要
讨论了电子软钎料的钎焊性能及其影响因素,钎料的钎焊性能很大程度取决于钎料对基板的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面张力有关。通过建立简化的数学模型,得出了润湿角与钎料熔滴铺展面积间的数学关系式。文中采用铺展面积法对Sn-Ag-Bi系钎料钎焊性能进行评估,结果表明在添加少量的Zn,可在一定程度上提高钎料的润湿性能,并可减少Bi的用量。
The solderability of electronic solders and some factors that influence the solderability are discussed. The solderability depends, to a great extent, on the wettability, which is related with solid, liquid and gas interfacial tensions of the melted solders on substrates. The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model. The solderability of the solder based on Sn-Zn-Ag was evaluate by the test method of spreading areas. The results indicated that the solderability of the solder has been improved by adding Zn.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第7期26-29,共4页
Electronic Components And Materials
