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二甲基甲酰胺中电沉积镁镍合金的研究 被引量:6

Study on electrodeposition of Mg-Ni alloy in DMF
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摘要 研究了二甲基甲酰胺(DMF)溶液中Mg(II)和Ni(II)在Pt和Cu电极上的电化学行为;用恒电位法沉积出有金属光泽、致密、附着力好的Mg Ni合金膜,并用EDAX分析Mg Ni合金膜组成,其中Mg含量可达26 07%(质量比),用SEM分析膜表面形貌,用X—射线衍射(XRD)分析合金膜的形态为非晶态. The cyclic voltammetry was used to study the electrochemical behaviours of Mg(II) and Ni(II) in 02mol·cm-3Mg(ClO4)2-02mol·cm-3LiClO4-DMF,002mol·cm-3NiCl2-02mol·cm-3LiClO4-DMF on Pt electrode,and 02mol·cm-3Mg(ClO4)2-002mol·cm-3NiCl2-02mol·cm-3LiClO4-DMF systems on Pt and Cu electrodes.Smooth,adhesive,uniform and metalic luster Mg-Ni alloy films were prepared by potentionstatic electrolysis on Cu substrates at deposition potential ranges from -2.2V to -3.0V(vs.SCE).The Mg contents in the alloy films ranges from 12.21% to 26.07%(wt%) analysed by EDAX.Their surfaces are investigated by scanning microscopy.According to the analysis of X-ray,the alloy films are amorphous.
作者 王建朝
出处 《青海师范大学学报(自然科学版)》 2003年第2期48-51,共4页 Journal of Qinghai Normal University(Natural Science Edition)
基金 国家自然科学基金(50264004)资助项目.
关键词 Mg-Ni合金膜 恒电位沉积法 二甲基甲酰胺 Mg-Ni alloy film potentionstatic deposition dimethyformamide
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