摘要
利用有限元中的3-DSOLID模型分析CBGA组件的热变形、应变和应力的分布,表明有限元法是研究微电子封装中BGA焊点、CBGA组件的可靠性的方法。
3-D SOLID model of finite element simulation analysis was employed in CBGA thermal deformations, strain and stress. The results show finite element simulation analysis is a reliability method in study the BGA solder joint and the CBGA Assembly of microelectronic package.
出处
《电子器件》
CAS
2003年第2期143-147,132,共6页
Chinese Journal of Electron Devices
关键词
CBGA
热变形
焊点可靠性
有限元
CBGA
thennal deformation
reliability of solder
finite element simulation
