摘要
由于传统的光刻生产工艺有透镜光学极限性 ,压印光刻为集成电路的生产提供了一种新思路。在压印光刻中 ,模具的制造是重点。为了获得高精度的压印模具 ,在实验中着重从模具材料的选择、固化剂的添加量、真空压力大小、固化温度、固化时间等方面进行分析和研究。采用正交实验方式和数理方差分析 ,通过检测压印模具的平整度、一致性、特征尺寸及模具表面的固化收缩率等参数的变化 ,特别是模具的特征尺寸变化 。
It is well known that optical limitation is t he bottle neck in traditional lithography process. A new process, imprint lithogra phy, is presented in this paper, and in this process the mold is part of the key techniques. Based on the research as follows: the amount of curing agent, th e solidifying temperature and time, and the analysis of flatness, uniformity, fe ature sizes and shrinkage ratio of resist on mold, the perfect stamp and optimal manufacturing process is achieved.
出处
《机械科学与技术》
CSCD
北大核心
2003年第4期627-628,631,共3页
Mechanical Science and Technology for Aerospace Engineering
