金属基电子封装复合材料的研究进展

Review of Metal-Matrix Composite Materials for Electronic Packaging

集成电路和芯片的封装技术的快速发展对封装材料提出了更高的要求。由于传统的金属封装材料不能满足现代封装技术的发展需要 ,向金属基体内添加低热膨胀系数的陶瓷或其它物质制成金属基电子封装复合材料已成为金属基复合材料今后重点发展的方向之一。本文阐述了金属基体、增强体及其体积分数。

The rapid development of IC and packaging technology has led to search for new packaging materials The traditional metal packaging materials can not meet the needs of the development of packaging technology It is urgently to develop metal matrix composites for packaging materials by means of adding the lower CTE ceramic or other materials to the metal matrix This paper reviews the influence of metal matrix,reinforcement and processing methods on thermal properties of composite materials