摘要
研究了BaTiO3基的片式PTCR陶瓷的注浆成型工艺 ,包括浆料的制备、粘合剂PVA用量及与粘度等之间的关系 ,采用PMAA NH4 为分散剂 ,加入适量PVA(质量分数wP 为 1%～ 2 % ,占粉料 )可获得固相质量分数w为 75 %～ 80 %的浆料 ,后烧成的瓷片与轧膜成型、Gelcasting(凝胶注膜 )成型方法获得的瓷片进行了主要性能比较 .同时采用注浆成型工艺成功制备出了多层PTCR热敏电阻器 .
Slip casting process of PTCR ceramic based BaTiO 3 w as studied including the preparation of slurries, the optimal addition amount of P VA bonder. High solid loading with optimum amount of dispersing and binder agent s were obtained when dispersant is PMAA-NH 4 and the range of binder is 1?%～ 2?%. The sintered PTC chip by slip casting was compared with gel-casting and r oll forming in their main electrical properties. The multilayer chip PTCR by sli p casting with PTC effect was obtained.
出处
《华中科技大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2003年第7期22-24,共3页
Journal of Huazhong University of Science and Technology(Natural Science Edition)
基金
国家高技术研究发展计划资助项目 (2 0 0 1AA3 2 5 0 40 )
关键词
片式PTCR
注浆成型
浆料
chip PTRC
slip casting
slurry Chen Yan Postgraduate
Dept. of Electronic Sci. & Tech. , Huazhong Univ. of Sci. & Tech., Wuhan 430074, China.
