摘要
在一个芯片上设计了六组不同规格的矩形压阻悬臂梁 .采用ANSYS有限元分析系统对微压阻悬臂梁进行应力分析 ,并对压阻悬臂梁的噪声、灵敏度以及最小可探测位移进行了研究 .选用多晶硅为压阻材料 ,以硅微机械加工技术为基础 ,完成了阵列式压阻悬臂梁的制备 .通过测量器件的噪声和灵敏度 ,计算出在 6V偏压和 10 0 0Hz测量带宽下 ,多晶硅悬臂梁的最小可探测位移为 1nm .
Six groups of piezoresistive cantilever with different sizes are designed on a chip.The stress of rectangle cantilever is simulated with a common FEA simulator ANSYS TM .The noise,the signal,and the minimum detectable deflection (MDD) of piezoresistive cantilever are studied.Based on the silicon micromachining technology,the piezoresistive cantilever is fabricated with polysilicon as the piezoresistive material.With the measurement results of noises and sensitivities,the MDD of piezoresistive cantilever is calculated to be 1nm at a 6V bias voltage and a 1000Hz measurement bandwidth.
基金
国家自然科学基金 (批准号 :90 2 0 70 13 )
教育部留学回国人员科研启动资金
博士后基金资助项目~~
关键词
悬臂梁
噪声
灵敏度
最小可探测位移
cantilever
noise
sensitivity
minimum detectable deflection
