SAW器件芯片底部处理的工艺实验研究

Experimental Reserch on Processing on the Back of SAW Substrate

介绍声表器件中几种体波模型,讨论什么传播方式的体波可以通过底部处理得到抑制或消除,同时对底部处理的工艺特别是打毛和刻沟槽两种方式进行讨论和比较,通过实验和分析得出选择底部处理工艺的依据。另外,文中还提到一些辅助方式如粘接剂的选择和端面处理等。

This paper introduces several BAW modes and the ways to suppress or diminish the BAW The advantages and disadvantage of sand blasting and grooving on the back of substrates are compared and discussedSome other methods such as appropriate adhesive are also mentioned in the paper