摘要
分析装配机械应力导致微带隔离器中铁氧体基片出现裂纹甚至断裂的失效机制,给出微带隔离器与其它电路单元连接的几种低应力接头结构,讨论微带隔离器中AgPd厚膜导体在焊接过程中出现熔蚀现象的原因和对策。
One failure mechanism for which assembling stress may result in fracture or crack in the ferrite substrate has been analyzed. Some kind of low stress joint between the microstrip ferrite isolator and other components are suggested. The leaching effect in soldering of the AgPd thick film on the microstrip ferrite isolator has been briefly discussed, and solutions to the problem are given.
出处
《电子机械工程》
2003年第4期39-41,46,共4页
Electro-Mechanical Engineering
