摘要
本文主要介绍了印制电路板组装件焊接后非ODS清洗剂清洗质量表征参数的测量方法。这些参数主要包括:外观、干燥度、离子污染、助焊剂残留、表面绝缘电阻和电迁移等。
The measurement method of the characteristic parameters of the cleaning quality about welded printed circuit board assembly cleaned by non-ODS cleaner is introduced in this paper. It'mainly concludes these characteristic parameters, such as visual, dryness, ion contamination, welding flux residual, surface insulation resistance and electric migration et al.
关键词
印制电路板
组装件
非ODS清洗
清洗质量
检测方法
表征参数
Printed circuit board assembly, Non ODS cleaning cleaning quality, characteristic parameters, measurement method
