半导体晶圆车间的成本控制方法

Methods of cost controlling in semiconductor wafer fab

由于市场对专用集成电路需求的猛增,大多数半导体企业都已采用面向订单的混合生产方式,其车间设施具有一定的柔性,能同时生产多种类型的晶圆;再加上CIM与价格昂贵、自动化程度极高的晶圆加工设备的广泛运用,引起了晶圆车间成本构成中直接人工费用大幅度减少和间接费用呈多样化巨增,因此晶圆制造车间已开始改变为从工程学、技术层面去把握成本信息,以工程经济学的方法对成本进行预测、监控,因为在晶圆制造车间中,成本绝非单纯是会计帐簿上的产物,而是在制造过程中的逐道工序中产生的。

Since the demand of IC increases dramatically, most semiconductor companies useMTO(make-to-order) to produce, and the wafer fab is not only flexible, but also can accommodatemany kinds of products at the same time; what's more, CIM technology and the expensive andhighly-automated equipments are applied in it, which makes the direct labor cost decrease largelyand indirect cost increase in diversification. Cost, in wafer fab, is not only the product of accountbooks, but comes into being from the one by one process in manufacturing. Therefore, wafer fab hasturned to control cost information from engineering and technology aspect, forecast and monitorcost by engineering science.