6Tench D M,White J T.Considerations in Electrodeposition of Compositionally Modulated Alloys[J].Electrochem Soc,1990,137(10):3 061 -3 066.
7Despic A R,Jovic V D,Spaic S.Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition[J].Electrochemical Soc,1989,136 (6):1 651 -1 657.
8Papachristos V D,Panagopaclus C N.Young's modolus,hardness and cratch adhension of Ni-P-W multiplayered alloy coatings produced by pulse plating[J].Thin Solid Films,2001,396(1,2); 173 - 182.
9Verbrugge M W,TobiasCharles W.A Mathematical Model for the Periodic Electrodeposition of Multicomponent Alloys[J].Electrochem Soc,1985,132 (6):1 298 - 1 307.
10Gabe D R,Green W A.The mathematical modeling of CAM multilayered coatings[J].Surface and Coatings Technology,1998,105:195 - 201.
