摘要
结合同时考虑机构设计和控制策略的思想 ,提出一种新型的可应用于微电子封装与组装行业中的两自由度平面并联机器人机构 ,其具有高刚度、高速度、高精度的特点。对机构进行了运动学、动力学分析和基于加速度反馈的解耦控制研究。
The mechanism of a new two degree of freedom planar parallel robot applied to microelectronics packaging and assembly is introduced, inspired by the design methodology of integrated design of mechanical structure and control algorithm. The proposed mechanism is of higher stiffness, higher speed and higher precision than conventional parallelogram closed loop mechanisms. Then, kinematics and dynamics of the mechanism are studied. Decoupling control algorithm based on acceleration feedback is also designed to resist coupling effects. Digital simulations are conducted on the planar parallel robot and the results are presented to validate the decoupling control algorithm.
出处
《高技术通讯》
EI
CAS
CSCD
2003年第7期69-73,共5页
Chinese High Technology Letters
基金
863计划 ( 2 0 0 1AA42 3 110 )资助项目