导热型高性能树脂微电子封装材料之二:封装材料的导热和热膨胀性能

Thermal Conductive High Performance Polymer Microelectronic Packaging Material Ⅱ Thermal Conductivity and Thermal Expansion of the Packaging Material

微电子行业迫切需要新一代优异性能的封装材料。采用聚酰亚胺/氮化铝复合材料作为封装材料,可以组合聚酰亚胺和氮化铝的优点,具有高导热、低热胀、低介电、电绝缘等优异的性能,应用于现代微电子领域前景良好。文章讨论了这种封装材料的导热性能和热膨胀性能。PMR聚酰亚胺/氮化铝复合封装材料导热系数随氧化铝的加入量而显著提高,Bruggeman方程最适合于描述该封装材料的导热系数。PMR聚酰亚胺与氮化铝复合后热膨胀系数显著减小。

It is an urgent demand of new generation packaging materials with excellent properties in the micrelectronic industry. Polyimide/AlN composite materials, combining the properties of polyimide and AlN, exhibits high thermal conductivity, low thermal expansion coefficient, low dielectric constant, and excellent insulation, and will be an attractive packaging material. The thermal conductivity and thermal expansion of the packaging material is discussed in this paper. The thermal conductivity of the polyimide/AlN packaging material increases dramatically with the increase of AlN, and can be described quite well with Bruggeman's equation. The coefficient of thermal expansion of the packaging material decreases obviously with the increase of AlN.