摘要
介绍了MCM混合电路用导电胶的组成及其工艺特点,对两种测试导电胶体电阻率的方法进行了探讨,并对其优缺点进行了比较。此外,还简要介绍了混合电路用导电胶的发展动向。
The composition of conducting adhesives and its characteristics are describedTwo methods for measurement of the volume resistivity of conducting adhesives are discussed,and the advantages and disadvantages of each method are compared Finally,the developing trend of the conducting adhesives for hybrid circuits is viewed
出处
《微电子学》
CAS
CSCD
北大核心
2003年第4期298-300,305,共4页
Microelectronics
关键词
混合电路
导电胶
体电阻率
测试
MCM
封装材料
Hybrid circuit
Conducting adhesive
Volume resistivity
Packaging material
