摘要
喷镀式电镀已广泛应用于圆片级封装(WLP)中,电镀杯是喷镀装置中最关键的部件,杯中的匀流板又是影响电镀质量关键。对匀流板的形状和位置进行了计算机模拟和优化,并实际应用于喷镀装置中,取得了很好结果。
The fountain-plating is widely used for plating in wafer level package(WLP).Plating cup is the key com ponent in the plating apparatus and the diffuser is the most important part in cup,which will greatly affect the quality.The simulation and optimization of solution flow in the cup by computational fluid dynamics(CFD)tool have been intro duced in this paper.The results have been successfully used for the machine design.
出处
《电子工业专用设备》
2003年第4期49-52,67,共5页
Equipment for Electronic Products Manufacturing
关键词
喷镀
匀流板
封装
Fountain-Plating
Diffuser
Package
