多层片式PTCR瓷片烧成工艺及电性能关系的研究

Investigation on the relationship between the sintering processing and electrical properties of multiplayer chip PTCR

为研制一种独石结构的片式热敏PTC电阻器,采用轧膜成型工艺制备生坯薄片并在成瓷后叠层。为满足叠层所需的平整度与电性能参数,分别从烧成温度、升温速率、保温时间与降温速率等烧成工艺参数加以控制并给出了相应的讨论。确定了多层片式PTCR的最佳烧成工艺曲线并制备具有PTC效应的3层并联结构的热敏电阻器。

In order to fabricate a kind of multilayer PTCR thermistor, the ceramic films were prepared by roll forming and the multilayer were laminated after sintered. To meet with the requirements of evenness degree and electronic properties for laminating, we managed to control sintering processing parameters such as sintering temperature, soaking times, the rate of rising temperature and dropping temperature, and obtained the best sintering processing curves of the multiplayer chip PTCR. According to the proposed sintering processing, we fabricated threelayer PTCR ceramic element with better electrical properties and PTC effect.