摘要
研究了电沉积Ni B合金工艺中,氯化镍、硼氢化钠、乙二胺、酒石酸钾钠、稳定剂及电流密度、温度对镀层中硼含量和镀速的影响。结果表明,控制镀液成分和工艺条件,可获得含硼量为3%～4%的镀层,沉积速率在20μm/h左右。
The effects of NiCl\-2, NaBH\-4, ethylenediamine, sodium potassium tartrate, stabilizer, current density and temperature on the boron content of coatings and deposition rate were investigated. The bath composition and technological parameters were optimized experimentally. In a certain bath and condition, the coatings containing 3%～4% boron was obtained with 20 μm/h deposition rate.
出处
《材料保护》
CAS
CSCD
北大核心
2003年第8期44-46,共3页
Materials Protection
关键词
电沉积
Ni-B合金
硼含量
沉积速率
electrodepositing
Ni-B alloy
boron content
deposition rate.
