游离碳化硅磨粒辅助的蓝宝石固结磨料研磨研究

Study on the Grinding of Sapphire Using Fixed Abrasive with Free Silicon Carbide Particles

采用两种铜粉添加量的FAP,探索游离碳化硅磨料含量对蓝宝石研磨材料去除率和工件表面粗糙度的影响。结果表明:使用相同的研磨液时,铜粉含量高的FAP材料去除率大,表面粗糙度Ra差别不明显;使用相同的研磨垫时,材料去除率随研磨液中碳化硅浓度的增加而增加,FAP的自修正特性随碳化硅浓度的提高而改善。

Two types of fixed abrasive pad( FAP) which were added to different content of copper powder were used in order to explore the effect of the content of free silicon carbide abrasive on the removal rate and surface roughness of the sapphire. Results show that when using the same slurry,the FAP with high content of copper powder has a greater material removal rate and a little difference in surface roughness Ra. When using the same FAP,the material removal rate increases with the increase of silicon carbide concentration in the slurry,and the self modification of FAP is improved with the increase of the concentration of silicon carbide.