摘要
介绍了粘接体系界面的扩散作用、机械作用、双电层吸引作用以及弱界面层的产生及其对粘合性能的影响 ,另外 ,讨论了现代表面分析技术如ESCA、ATR、EPMA、SEM、STM及AFM等在表面。
This paper interpreted the interfacial diffusive action, mechanial action, double electrode layer attractive action and the producting of W.B.L and it's effect on the adhesion property. Moreover, the application of modern surfacial analysis such as ESCA, ATR, EPMA, SEM, STM and AFM in the characterization of surface and interface are simply introduced.
出处
《粘接》
CAS
2003年第4期37-42,共6页
Adhesion