高性能BT树脂基覆铜板的研制

Preparation of Copper Clad Laminates with High Performance BT Resin

研制出了双烯封端棒状聚酰亚胺,并用其改性BT树脂,制得了低收缩BT树脂/石英布覆铜板。其平面方向热膨胀系数为3.1106℃1,厚度方向为1.3105℃1,优于国外同类产品;另用聚苯醚改性BT,制得低介电常数的BT树脂/玻璃布覆铜板,其er可小到3.6(106 Hz),厚度方向热膨胀系数为4.07×105℃1。改性后保留了BT树脂的其它优良特性。

Rod-like polyimide capped with biethenylene was developed and used in the modification of bismaleimide/triazine-based resin (BT resin). Of the low expansion coefficient copper clad laminates based on thus modified BT resin and quartz fabric, the expansion coefficient is 3.1106C1 (x-y orientation) and 1.3105C1 (z orientation). BT resin was also modified by polyphenyl oxide. Of the low dielectric copper clad laminates based on thus modified BT resin and glass fabric, er is as low as 3.6, at 106 Hz, and expansion coefficient 4.07105C1 (z orientation). The original excellent properties of the BT resin remain the same after the modification.